Ai Technology, Inc.
More than 20 years in pioneering phase-change thermal interface materials of thermal adhesives and interface compounds:
- Patented compressible phase-change thermal interface gap-pad material for large area gap-filling
- Cool-Grease® with the measured lowest thermal resistance
- Cool-Gel® gap-filling thermal interface gel for conductive or insulating applications
- Cool-Bond® paste and film adhesives with low thermal resistance
- In-situ curable instant bonding thermal adhesive tapes
- Insulated Metal Substrate and multi-layer pre-preg for power modules and LED panels
70 Washington Road Princeton Junction, NJ 08550 United States
Phone: +1 (609) 799-9388
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Other Categories:
Thermal Management » Thermal Substrate Materials
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